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How to Prevent Solder Joint Voiding and Cold Solder Defects

2017-06-09

Solder joint voiding is a phenomenon that causes empty spaces or voids to occur within the joint. Solder joint voiding often occurs on BGAs and larger pads. Voids are related to flux that’s entrapped in the joint, as well as paste oxidation.

How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?

2017-06-08

The 3528 PLCC RGB LED*, such as theLG LEMCS32F00AZ01, has ultra high brightness in a compact size. Heat dissipation should be considered during layout design. The traces that connect each LED pad should be designed as wide as possible.

How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process

2017-06-07

A solder ball is the most common type of defect that occurs in the SMT assembly process. Solder balls, which have a diameter are greater than 0.13mm or they are within 0.13mm of traces, violate the minimum electrical clearance principle.

How to Prevent Short Circuits to Ground in QFN Components?

2017-06-06

In the PCB layout design stage, the designer should consider adding the same size exposed copper pan in the center of QFN land pattern. This offers a heat conduit for thermal relief that makes the components work with more stability.

How to Prevent Non-Wetting Defect during the SMT Reflow Process

2017-06-05

Wetting issues are classified by Non-wetting and Dewetting. According to the IPC standard, non-wetting is defined as the inability of molten solder to form a metallic bond with the base metal.

How To Place Diodes Using Silk Screen Marks

2017-06-03

Diodes are polarized components that must be placed on a PCB in a certain way. However, a board that has a (+) silk screen marking is not enough information to tell the assembly house how to correctly insert a diode because there are different types of di

How to optimize the reflow profile?

2017-06-02

According to the recommendation by the IPC association, the generic Pb-free solder reflow profile is shown below. The GREEN area is the acceptable range for the whole reflow process. Does it mean that every spot in this GREEN area should fit your board re

How to Maintain a Reflow Oven?

2017-06-01

Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality. One of the most important tasks for properly maintaining a reflow oven is remove the built-up flux residu

How to get real-time thermal data for a PCB?

2017-05-31

Although there is a thermal data testing function for our reflow oven, Shenzhen Grande Electronic still uses a high-end, off-line, KIC thermal profiler as our key instrument for optimizing the reflow profile for every board.

How to Get a Quote for Turnkey Circuit Assembly?

2017-05-26

Turnkey printed circuit board assembling manufacturers mainly provide both types of assembling services i.e. Full Turnkey service including ordering all parts and Partial Turnkey service where the customer arranges for circuit boards or components and the

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